Kev Pabcuam Tom Qab
Kev xeem ntawv pov thawj AEC-Q 104yog ib qho kev ntsuam xyuas kev ntxhov siab tshwj xeeb rau automotive multi chip Cheebtsam (MCM) raws li kev ua haujlwm tsis ua haujlwm. MCM multi chip module specification daws qhov teeb meem ntawm seb IC tsim cov tuam txhab thiab Tier 1 automotive module cov neeg muag khoom yuav tsum ua raws IC lossis module specifications hauv ntau daim ntawv chip xws li MCM, System In Package (SIP), thiab Stacked Chip. Nws kuj yog thawj zaug hauv cov qauv kev lag luam automotive uas lub Board Level Reliability (BLR) sim qhov project rau kev siv tsheb tau raug txhais.
Yam khoom
Automotive multi chip Cheebtsam
Cov khoom kuaj
● Pab pawg A: Kev sim ntsuas ib puag ncig kom nrawm (6 yam khoom)
● Pab pawg B: Kev sim ua lub neej nrawm nrawm (3 yam khoom)
● Pab pawg C: Kev ntsuas kev ntim khoom thiab sib dhos (8 yam khoom)
● Pab pawg D: Kev ntseeg siab ntawm kev tsim khoom wafer (5 yam khoom)
● Pab pawg E: Kev kuaj xyuas tus yam ntxwv hluav taws xob (10 yam khoom)
● Pab pawg F: Kev soj ntsuam xyuas qhov tsis zoo (2 yam khoom)
● Pab Pawg G: Kev ntsuas kev ncaj ncees ntawm cov khoom siv cua kaw (8 yam khoom)
● Pab pawg H: Cov kev ntsuas tshwj xeeb (7 yam)
Test Cycle
Txog 2-3 hli
Txheej txheem xeem
Piv txwv li Case
Cim npe nrov: Tuam Tshoj aec-q 104 certification testing muab kev pabcuam