Cov ntsiab lus kev pabcuam
IC, uas yog ib qho tseem ceeb ntawm kev tsav tsheb, yog qhov tseem ceeb ntawm kev saib xyuas tas li rau pawg AEC. Kev ntsuam xyuas kev ntseeg siab ntawm AEC-Q100 ntawm ICs tuaj yeem muab faib ua kom ceev ib puag ncig kev ntxhov siab, ua kom lub neej simulation kev cia siab, ntim kev ntseeg siab, txheej txheem wafer kev ntseeg tau, hluav taws xob tsis zoo, kev tshuaj ntsuam xyuas tsis raug, kev ntsuas kev ntim khoom, thiab cov kev sim yuav tsum tau xaiv raws li. ntawm qhov kub thiab txias uas lub cuab yeej tuaj yeem tiv taus.
Kev pov thawj ntawmAEC-Q100 kev xeem ntawv pov thawjyuav tsum muaj kev koom tes ntawm wafer lwm tus neeg thiab ntim khoom thiab kuaj cov chaw tsim khoom, uas ntxiv kev ntsuam xyuas tag nrho cov peev txheej ntawm kev xeem ntawv pov thawj. RGT yuav soj ntsuam cov neeg siv khoom ICs raws li lawv cov kev xav tau thiab cov qauv, thiab muab cov phiaj xwm ntawv pov thawj tsim nyog los pab hauv kev ntseeg tau ntawm ICs.
Test Cycle
Txog 3-4 hli.
Cov khoom kuaj
|
S/N |
Cov khoom kuaj |
Cov ntawv luv |
Qauv nab npawb/Batch |
Batch Number |
Txoj Kev Xeem |
|
Pawg A Accelerated Environmental Stress Test |
|||||
|
A1 |
Kev kho ua ntej |
PC |
77 |
3 |
J-STD-020, |
|
JESD22-A113 |
|||||
|
A2 |
Kub-Humidity-Bias |
THB |
77 |
3 |
JESD22-A101 |
|
Biased HAST |
HAST |
JESD22-A110 |
|||
|
A3 |
Autoclave |
AC |
77 |
3 |
JESD22-A102 |
|
Tsis ncaj ncees HAST |
UHST |
JESD22-A118 |
|||
|
Kub-Humidity (tsis muaj Bias) |
TH |
JESD22-A101 |
|||
|
A4 |
Kub Cycling |
TC |
77 |
3 |
JESD22-A104, Ntxiv 3 |
|
A5 |
Lub Hwj Chim Kub Cycling |
PTC |
45 |
1 |
JESD22-A105 |
|
A6 |
Kev Kub Kub Cia Lub Neej |
HSTL |
45 |
1 |
JESD22-A103 |
|
Pab pawg B Accelerated life simulation xeem |
|||||
|
B1 |
Kev kub kub ua haujlwm lub neej |
HTOL |
77 |
3 |
JESD22-A108 |
|
B2 |
Early Life Failure Rate |
ELFR |
800 |
3 |
AEC-Q100-008 |
|
B3 |
NVM Endurance, Data Retention, thiab Kev Ua Haujlwm Lub Neej |
EDR |
77 |
3 |
AEC-Q100-005 |
|
Pawg C Encapsulation kev ntsuam xyuas kev ncaj ncees |
|||||
|
C1 |
Hlau Bond Shear |
WBS |
30 sib txuas xov hlau hauv tsawg kawg yog 5 khoom siv |
AEC-Q100-001,AEC-Q003 |
|
|
C2 |
Hlau Bond Pull |
WBP |
MIL-STD883 txoj kev 2011, |
||
|
AEC-Q003 |
|||||
|
C3 |
Solderability |
SD |
15 |
1 |
JESD22-B102或 J-STD-002D |
|
C4 |
Lub cev Dimensions |
PD |
10 |
3 |
JESD22-B100, JESD22-B108 |
|
AEC-Q003 |
|||||
|
C5 |
Solder Pob Shear |
SBS |
Tsawg kawg yog 5 lub pob sib txuas rau 10 khoom siv |
3 |
AEC-Q100-010, |
|
AEC-Q003 |
|||||
|
C6 |
Coj Kev Ncaj Ncees |
LI |
Tsawg kawg yog 10 ua rau 5 khoom siv |
1 |
JESD22-B105 |
|
Pab pawg D Wafer raug kuaj kev ntseeg siab |
|||||
|
D1 |
Electromigration |
EM |
/ |
/ |
/ |
|
D2 |
Lub Sijhawm Dependent Dielectric Breakdown |
TDDB |
/ |
/ |
/ |
|
D3 |
Kub Carrier Txhaj Tshuaj |
HCI |
/ |
/ |
/ |
|
D4 |
Tsis zoo Bias Temperature Instability |
NBTI |
/ |
/ |
/ |
|
D5 |
Kev nyuaj siab tsiv teb tsaws chaw |
SM |
/ |
/ |
/ |
|
Pab pawg E Kev kuaj xyuas hluav taws xob |
|||||
|
E1 |
Pre- thiab Post-Stress Function / Parameter |
TEST |
Tag nrho cov qauv xav tau rau kev ntsuas kev ntxhov siab hauv kev ntsuas hluav taws xob |
Tus neeg siv khoom lossis tus neeg siv cov specifications |
|
|
E2 |
Electrostatic Discharge Tib Neeg Lub Cev Qauv |
HBM |
Reference Test Specification |
1 |
AEC-Q100-002 |
|
E3 |
Electrostatic Discharge Charged Device Model |
CDM |
Reference Test Specification |
1 |
AEC-Q100-011 |
|
E4 |
Latch-Up |
LU |
6 |
1 |
AEC-Q100-004 |
|
E5 |
Kev faib hluav taws xob |
ED |
30 |
3 |
AEC Q100-009 |
|
AEC Q003 |
|||||
|
E6 |
Fault Grading |
FG |
- |
- |
AEC-Q100-007 |
|
E7 |
Cim xeeb |
CHAR |
- |
- |
AEC-Q003 |
|
E9 |
Electromagnetic Compatibility |
EMC |
1 |
1 |
SAE J1752/3- |
|
E10 |
Short Circuit Characterization |
SC |
10 |
3 |
AEC-Q100-012 |
|
E11 |
Soft yuam kev Rate |
SER |
3 |
1 |
JEDEC |
|
JESD89-1 |
|||||
|
JESD89-2 los yog JESD89-3 |
|||||
|
E12 |
Lead (Pb) Dawb |
LF |
Reference Test Specification |
Reference Test Specification |
AEC-Q005 |
|
Pab pawg F Defect tshuaj ntsuam xyuas |
|||||
|
F1 |
Txheej txheem nruab nrab xeem |
PAT |
/ |
/ |
AEC-Q001 |
|
F2 |
Statistical Bin/Yield Analysis |
SBA |
/ |
/ |
AEC-Q002 |
|
Pawg G Sealing thiab ntim kev kuaj xyuas kev ncaj ncees |
|||||
|
G1 |
Mechanical shock |
MS |
15 |
1 |
JESD22-B104 |
|
G2 |
Variable Frequency Vibration |
VFV |
15 |
1 |
JESD22-B103 |
|
G3 |
Tsis tu ncua Acceleration |
CA |
15 |
1 |
MIL-STD883 Method 2001 |
|
G4 |
Gross/Fine Leak |
GFL |
15 |
1 |
MIL-STD883 Txoj Kev 1014 |
|
G5 |
Pob pov |
DROP |
5 |
1 |
/ |
|
G6 |
Lid Torque |
LT |
5 |
1 |
MIL-STD883 Txoj Kev 2024 |
|
G7 |
Tuag Shear |
DS |
5 |
1 |
MIL-STD883 Txoj Kev 2019 |
|
G8 |
Internal Dej Vapor |
IWV |
5 |
1 |
MIL-STD883 Txoj Kev 1018 |
Cim npe nrov: Tuam Tshoj aec-q100 certification testing service provider
